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High temperature baking

Assess whether the product and its materials can withstand the most adverse conditions in harsh environments

High temperature baking test is an environmental reliability testing method used to evaluate the performance stability of products and their materials in high temperature environments. By simulating extreme high temperature conditions in harsh environments, test whether the product can withstand and maintain normal functionality. The following is a detailed explanation of the high-temperature baking test:

 

1. Test purpose
Evaluate high temperature resistance: Test whether the physical, chemical, and electrical properties of the product and its materials are stable in high temperature environments.

Identify potential defects: Expose material aging, deformation, cracking, and other issues that may occur in products exposed to high temperature environments.

Verify design reliability: Ensure that the product can operate normally within the specified temperature range.

 

2. Testing principle
Place the sample in a high temperature environment (usually above the normal operating temperature of the product) for a certain period of time.

Observe the performance changes of the sample at high temperatures, such as appearance, size, mechanical strength, electrical performance, etc.

Determine whether the product meets the requirements for use in high-temperature environments based on the test results.

 

3. Testing equipment
High temperature test chamber: It can provide a stable high temperature environment, with a temperature range usually from room temperature to 300 ℃ or higher.

Temperature monitoring equipment: such as thermocouples or temperature recorders, used for real-time monitoring of sample temperature.

Testing tools: such as calipers, microscopes, electrical testers, etc., used to detect changes in the performance of samples.

 

4. Testing steps
Preparation work:

Determine the testing temperature and time (based on the product usage environment and relevant standards).

Clean the surface of the sample to ensure that there are no contaminants such as dust, oil, etc.

Record the initial state of the sample (such as appearance, size, electrical performance, etc.).

Place the sample:

Place the sample in the high-temperature test chamber, ensuring sufficient space between the sample and the chamber wall to avoid uneven thermal radiation.

Install temperature monitoring equipment to ensure that the sample temperature reaches the set value.

 

Heating up and maintaining:

Raise the temperature of the test chamber to the target temperature at the specified heating rate.

Maintain the target temperature for a certain period of time (usually 24 hours to 1000 hours, depending on standard requirements).

Cooling and removal:

After the test is completed, lower the temperature of the test chamber to room temperature at the specified cooling rate.

Take out the sample and let it stand for a period of time to recover to a stable state.

Testing and evaluation:

Check the appearance changes of the sample (such as discoloration, deformation, cracking, etc.).

Measure the size changes of the sample (such as shrinkage, expansion, etc.).

Test the mechanical properties (such as strength, hardness, etc.) and electrical properties (such as insulation resistance, withstand voltage, etc.) of the sample.

Record the test results to determine if the sample is qualified.

 

5. Testing standards
IEC 60068-2-2: Environmental testing for electrical and electronic products - Part 2: High temperature testing.

GB/T 2423.2: Environmental testing for electrical and electronic products - Part 2: High temperature test (Chinese standard).

JESD22-A108: High temperature storage life testing of semiconductor devices.

ISO 188: High temperature aging test for rubber and plastic materials.

 

6. Test parameters
Test temperature:

Determine based on the product usage environment and relevant standards.

For example, electronic products are typically tested at temperatures of 85 ℃, 105 ℃, or 125 ℃.

Test time:

Usually ranging from 24 hours to 1000 hours, depending on standard requirements.

Heating/cooling rate:

Usually ranging from 1 ℃/min to 3 ℃/min, with specific rates according to standard requirements.

 

7. Common problems and improvements
Material aging:

Choose materials with better high-temperature resistance.

Optimize product design to reduce the impact of high temperatures on critical components.

Deformation or cracking:

Improve material formula and enhance thermal stability.

Increase structural support to reduce stress concentration at high temperatures.

Performance degradation:

Optimize production processes to ensure material uniformity.

Add heat dissipation design to reduce the impact of high temperature on electrical performance.

 

8. Practical application
Electronic products, such as circuit boards and chips, require high-temperature baking testing to evaluate their reliability.

Automotive components, such as engine parts and seals, need to be tested for durability in high temperature environments.

Plastic and rubber products, such as sealing rings and cables, need to be tested for their aging performance at high temperatures.

 

summary
High temperature baking test is an important method for evaluating the performance stability of products and their materials in high temperature environments. By simulating extreme high temperature conditions in harsh environments, potential defects can be identified and the reliability of product design can be verified. During testing, attention should be paid to the accuracy of temperature, time, and performance evaluation to ensure the validity of the test results.

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